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Machine Listing - Chemical Vapor Depositors

IEN 117797
Equipment Class Wafer Fabrication
Quantity One (1)
Manufacturer Applied Materials
Type TEOS Oxide
Year (Age) 1993
Model 5000CVD

  Applied Materials Model 5000CVD, Cluster PECVD Tool. Wafer size 150mm. Three (3) Process Chambers: Oxide: LH DRYVAC 100S; RUVAC 250. Software Revision Level Boss 4.8; Process Gasses TEOS/O2/C3F8; Accessories include: Chiller, LL Pump, TRIVAC D40BC. Maximum Temperature 70 C; Dimensions are 120cm wide x 120cm deep x 190cm tall. Weight 900 Kg. Manufactured in 1993.