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Machine Listing - Chemical Vapor Depositors
IEN
117797
Equipment Class
Wafer Fabrication
Quantity
One (1)
Manufacturer
Applied Materials
Type
TEOS Oxide
Year (Age)
1993
Model
5000CVD
Please Contact Us for More Information
Description:
Applied Materials Model 5000CVD, Cluster PECVD Tool. Wafer size 150mm. Three (3) Process Chambers: Oxide: LH DRYVAC 100S; RUVAC 250. Software Revision Level Boss 4.8; Process Gasses TEOS/O2/C3F8; Accessories include: Chiller, LL Pump, TRIVAC D40BC. Maximum Temperature 70 C; Dimensions are 120cm wide x 120cm deep x 190cm tall. Weight 900 Kg. Manufactured in 1993.